FAB Services
MOSIS 2.0 offers rapid prototyping and process development capability through access to seven university nanofabrication facilities (USC, UCI, UCLA, UCR, UCSB, UCSD, and Caltech) and three DoD-volume fabs (Northrop Grumman, Teledyne, and HRL Laboratories) within the Southern California area. Our university and industry partners have extensive process experience in silicon CMOS and advanced compound semiconductor technologies (GaAs, InP, GaN HEMT/HBT) and can support development on wafer sizes from 100mm to 300mm. The MOSIS 2.0 Prototype Integration and Engineering Service (PIES) team also provides white-glove process development service to enable customer needs to be seamlessly translated to quality prototypes/products via process flow development, fabrication oversight, and quality and test controls implemented at each critical process step.
Our Nanofabrication Partners
Available Fab Capability
Process Categories
Lithography | PVD | CVD | Dry Etch | Wet Process | Thermal |
---|---|---|---|---|---|
Aligner, Contact Aligner, E-beam, FIB, Maskless Aligner, Stepper (i-line, DUV) | E-beam, Sputter (DC/RF), Thermal | PECVD, LPCVD, ALD, (Thermal, Plasma), Parylene | ICP-RIE, RIE, DRIE, ALE, Plasma Asher, IBE, lon Mill, Vapor Etch (XeF2, HF) | HF/BOE, Metal Etch, KOH, Solvent Clean, Acid Clean, Electroplating | RTP, Tube, Furnace, Oxidation (Dry, Wet), Anneal |
Additional Process Equipment
CMP | Laser Processing | Surface Mod | Clean |
---|---|---|---|
Mechanical Polisher, Lapper, Grinder | UV Excimer Laser, Laser Micro-machining | UV Ozone, MVD | Solvent Bench, Acid Clean, Ultrasonic |
Substrates
Size (mm) | ||
---|---|---|
Type | Mininum | Maximum |
Silicon | pieces | 200 |
III-V | pieces | 150 |
Glass | pieces | 200 |
Polymer | pieces | 150 |
Process Specifications
Size (mm) | ||
---|---|---|
Process Type | Mininum | Maximum |
Lithography (Aligner) | pieces | 200 |
E-Beam | pieces | 200 |
ALD | pieces | 200 |
PECVD | pieces | 200 |
ICP-RIE | pieces | 200 |
PVD (Sputter) | pieces | 200 |