MOSIS 2.0 USC Viterbi Information Sciences Institute CA Dreams

FAB Services

MOSIS 2.0 offers rapid prototyping and process development capability through access to seven university nanofabrication facilities (USC, UCI, UCLA, UCR, UCSB, UCSD, and Caltech) and three DoD-volume fabs (Northrop Grumman, Teledyne, and HRL Laboratories) within the Southern California area. Our university and industry partners have extensive process experience in silicon CMOS and advanced compound semiconductor technologies (GaAs, InP, GaN HEMT/HBT) and can support development on wafer sizes from 100mm to 300mm. The MOSIS 2.0 Prototype Integration and Engineering Service (PIES) team also provides white-glove process development service to enable customer needs to be seamlessly translated to quality prototypes/products via process flow development, fabrication oversight, and quality and test controls implemented at each critical process step.

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Our Nanofabrication Partners

Caltech
University of California Irvine
University of California Los Angeles
University of California Riverside
University of California San Diego
University of California Santa Barbara
University of Southern California

Available Fab Capability

Process Categories

Lithography PVD CVD Dry Etch Wet Process Thermal
Aligner, Contact Aligner, E-beam, FIB, Maskless Aligner, Stepper (i-line, DUV) E-beam, Sputter (DC/RF), Thermal PECVD, LPCVD, ALD, (Thermal, Plasma), Parylene ICP-RIE, RIE, DRIE, ALE, Plasma Asher, IBE, lon Mill, Vapor Etch (XeF2, HF) HF/BOE, Metal Etch, KOH, Solvent Clean, Acid Clean, Electroplating RTP, Tube, Furnace, Oxidation (Dry, Wet), Anneal
Process specifications vary by facility and tool.

Additional Process Equipment

CMP Laser Processing Surface Mod Clean
Mechanical Polisher, Lapper, Grinder UV Excimer Laser, Laser Micro-machining UV Ozone, MVD Solvent Bench, Acid Clean, Ultrasonic
Process specifications vary by facility and tool.

Substrates

Size (mm)
Type Mininum Maximum
Silicon pieces 200
III-V pieces 150
Glass pieces 200
Polymer pieces 150
Process specifications vary by facility and tool.

Process Specifications

Size (mm)
Process Type Mininum Maximum
Lithography (Aligner) pieces 200
E-Beam pieces 200
ALD pieces 200
PECVD pieces 200
ICP-RIE pieces 200
PVD (Sputter) pieces 200
Process specifications vary by facility and tool.